Canteliver Probe Card
MPI Cantilever Probe Card is broadly used on gold bump and pad wafer tests for Show driver, logic, and memory unit. MPI’s cantilever probes tend to be the corresponding response to your demands of fine pitch, small pad sizing, large pace, fewer cleaning, multi-DUT, superior pin depend, and extremely-very low leakage demands. With remarkable craftsmanship, revolutionary architecture and tested methodologies according to mechanical and electrical simulation/measurement final results, producing MPI the highest cantilever provider throughout the world.
FCB Probe Card
The FCB Probe Card is considered the most mature engineering of buckling beam probe card. It truly is aimed to attain the semiconductor ship manufacture time-to-market place (TTM) and value of examination (COT) need. FCB is really a confirmed Resolution for a variety of semiconductor manufacturing tests from early engineering pilot-operates to high quantity manufacturing (HVM). FCB is ready for device demanding higher signal integrity probing (SI) and/or energy integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB ensures the entire world’s greatest overall Charge-of-ownership (COO) for various DUT programs.
EVS Probe Card
The EVS Probe Card is definitely an enhancement above the traditional buckling beam probe card. Critical features are bigger recent carrying capability (C.C.C.) and lessen well balanced contact drive (BCF), and All round MEMS-like characteristics. EVS can easily fulfill the necessity of State-of-the-art wafer probing. Precise alignment and fantastic planarity Management tend to be the critical variables contributing to stable Get in touch with resistance. With its capacity and general performance, EVS Probe Card is a perfect choice for advanced probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to desire for at any time finer pitch. It truly is designed for more compact Al pad, and is also perfect for tiny pitch software with peripheral and complete array pattern. With exact alignment and better planarity Command, Osprey can access larger efficiency by multi-DUT style and design. The forming wire (FW) type needle manufactured with MPI’s have micro fabrication method not just provides large-high-quality general performance but additionally permits effortless needle alternative and shortens retaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle which happens to be made for the desire of lower pressure probing. Furthermore, it includes a chance to satisfy higher C.C.C. and higher pin counts application. The MEMS procedure guarantees very steady needle attributes, along with the Distinctive framework design and style permits precise alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both here today and for many generations to come.
https://www.mpi-corporation.com/probecard/